Systems and Methods for Workpiece Processing

ABSTRACT

Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The plasma processing system can include a loadlock chamber. The loadlock chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a workpiece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow communication with the loadlock chamber and the process chamber. The transfer chamber includes a rotary robot. The rotary robot can be configured to transfer a plurality of workpieces from the stacked arrangement in the loadlock chamber to the at least two processing stations.

FIELD

The present disclosure relates generally to processing workpieces andmore particularly to systems for processing workpieces, such assemiconductor workpieces.

BACKGROUND

Processing systems which expose workpieces such as, semiconductor wafersor other suitable substrates, to an overall treatment regimen forforming semiconductor devices or other devices can perform a pluralityof treatment steps, such as plasma processing (e.g., strip, etch, etc.),thermal treatment (e.g. annealing), deposition (e.g., chemical vapordeposition), etc. To carry out these treatment steps, a system mayinclude one or more robots to move workpieces a number of differenttimes, for example, into the system, between various processingchambers, and out of the system. An important consideration in anysemiconductor processing system is footprint size of the system.Increased footprint size can take up more space in processingfacilities, leading to reduced throughput and increased costs.

Example configurations of processing systems for semiconductorworkpieces can include cluster-style tools, carousel-style tools, etc.In cluster-style tools, a plurality of semiconductor processing modulescan be arranged around a central robot for moving workpieces among theplurality of processing chambers. Cluster-style tools can have a largefootprint (e.g., take up a large amount of space) and can only support alimited number of processing chambers. In carousel-style tools,workpieces can be rotated among a plurality of process stations.Carousel-style tools can suffer from reduced process integrationflexibility and can be difficult to implement in conjunction withcluster configurations.

SUMMARY

Aspects and advantages of embodiments of the present disclosure will beset forth in part in the following description, or may be learned fromthe description, or may be learned through practice of the embodiments.

One example aspect of the present disclosure is directed to a processingsystem for processing a plurality of workpieces. The processing systemcan include at loadlock chamber. The loadlock chamber can include aworkpiece column configured to support a plurality of workpieces in astacked arrangement. The system can further include at least one processchamber, such as two process chambers. The at least one process chambercan have at least two processing stations. Each processing station canhave a workpiece support for supporting a workpiece during processing inthe process chamber. The system further includes a transfer chamber inprocess flow communication with the loadlock chamber and the at leastone process chamber. The transfer chamber includes a rotary robot. Therotary robot can be configured to transfer a plurality of workpiecesfrom the stacked arrangement in the loadlock chamber to the at least twoprocessing stations in the process chamber.

Other example aspects of the present disclosure are directed to systems,methods, and apparatus for processing semiconductor workpieces.

These and other features, aspects and advantages of various embodimentswill become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the present disclosure and, together with thedescription, serve to explain the related principles.

BRIEF DESCRIPTION OF THE DRAWINGS

Detailed discussion of embodiments directed to one of ordinary skill inthe art are set forth in the specification, which makes reference to theappended figures, in which:

FIG. 1 depicts a plan view of an example processing system according toexample embodiments of the present disclosure;

FIG. 2 depicts an example workpiece column according to exampleembodiments of the present disclosure;

FIG. 3 depicts a flow diagram of an example processing method accordingto example embodiments of the present disclosure;

FIG. 4 depicts a plan view of an example processing system according toexample embodiments of the present disclosure;

FIG. 5 depicts an example transfer position according to exampleembodiments of the present disclosure;

FIGS. 6A and 6B depict a flow diagram of an example processing methodaccording to example embodiments of the present disclosure;

FIGS. 7A, 7B, 7C, and 7D depict the example transfer of workpieces in aprocessing system according to example embodiments of the presentdisclosure; and

FIGS. 8A and 8B depict an example rotary robot performing a transfer ofa plurality of workpieces from a workpiece column to at least twoprocessing stations in a process chamber using a scissor motionaccording to example embodiments of the present disclosure.

DETAILED DESCRIPTION

Reference now will be made in detail to embodiments, one or moreexamples of which are illustrated in the drawings. Each example isprovided by way of explanation of the embodiments, not limitation of thepresent disclosure. In fact, it will be apparent to those skilled in theart that various modifications and variations can be made to theembodiments without departing from the scope or spirit of the presentdisclosure. For instance, features illustrated or described as part ofone embodiment can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that aspects of the presentdisclosure cover such modifications and variations.

Example aspects of the present disclosure are directed to systems forprocessing workpieces, such as semiconductor workpieces, opto-electronicworkpieces, flat panel displays, or other suitable workpieces. Theworkpiece materials can include, for instance, silicon, silicongermanium, glass, plastic, or other suitable material. In someembodiments, the workpieces can be semiconductor wafers. The system canbe used to implement a variety of workpiece manufacturing processes,including, but not limited to vacuum anneal processes, surface treatmentprocesses, dry strip processes, dry etch processes, depositionprocesses, and other processes.

More particularly, the system can include a plurality of processchambers for processing the workpiece. Each process chamber can includea plurality of processing stations (e.g., two processing stations in atwin architecture) using a common process pressure (e.g., vacuum)environment. In some embodiments, one or more of the process chamberscan be plasma process chambers having plasma based process sources, suchas inductively coupled plasma sources, microwave sources, surface waveplasma sources, ECR plasma sources, capacitively coupled (e.g., parallelplate) plasma sources, etc.

In example embodiments, the processing system can include a loadlockchamber. The loadlock chamber can be configured to subject theworkpieces to processing pressure (e.g., vacuum pressure) prior totransferring the workpieces to a process chamber. The loadlock chambercan include a workpiece column having a plurality of shelves to holdworkpieces in a stacked arrangement. The system can further include atransfer chamber for transferring workpieces from the loadlock chamberto a process chamber and/or for transferring workpieces among differentprocess chambers. In some embodiments, the transfer chamber can bemaintained at a vacuum pressure or other suitable process pressure. Thetransfer chamber can be disposed in process flow communication betweenthe loadlock chamber and at least one process chamber.

According to example embodiments of the present disclosure, the transferchamber can include a rotary robot. A rotary robot can include a robotprimarily configured to transfer workpieces by rotating about an axis ata fixed point or area. The rotary robot can be configured to transfer aplurality of workpieces (e.g., two workpieces) from the workpiece columnin the loadlock chamber to two or more processing stations in theprocess chamber. Each processing station can include a workpiece supportfor supporting the workpiece during processing. In some embodiments, therotary robot can transfer the plurality of workpieces using a scissormotion, for instance, that simultaneously delivers workpieces to the twoor more processing stations in the process chamber. As used herein, ascissor motion refers to the movement of two or more robot arms similarto the opening or closing of scissors. For instance, in one examplescissor motion, first ends of the robot arms separate faster from oneanother than opposing second ends of the robot arms. In another examplescissor motion, first ends of the robot arms separate from one anotherwhile the second ends or other portions of the robot arms remained in afixed position.

In one example implementation, the rotary robot can include a pluralityof robot arms configured to rotate about a fixed pivot point. Each robotarm can be associated with one or more workpiece blades. Each workpieceblade can have an endeffector configured to support a workpiece. Therotary robot can be configured to control the plurality of robot arms totransfer workpieces from the workpiece column to the at least twoprocessing stations in a process chamber using a scissor motion wherethe plurality of robot arms separate from one another to transfer theworkpiece blades to the processing stations.

In another example implementation, the rotary robot can include a singleprimary arm that rotates about a pivot point or pivot area. The singleprimary arm can be coupled to a plurality of secondary arms. Thesecondary arms can each be coupled to at least one workpiece blade. Eachworkpiece blade can include an endeffector for supporting a workpiece.In some embodiments, the rotary robot can be configured to transfer atleast two workpieces from the workpiece column in the loadlock chamberto two processing stations in the process chamber using a scissormotion. During the scissor motion, the secondary arms can separate in ascissor like fashion so that the workpiece blade associated with one ofthe secondary arms transfers a workpiece to a first processing stationand so that the workpiece blade associated with another of the secondaryarms transfers a workpiece to the second processing station.

In some embodiments, the single primary arm and scissor motion of thesecondary arms can be operated using a single motor. In someembodiments, the rotary robot can have a second primary arm coupled to aplurality of secondary arms. The second primary arm can be operated in amanner similar to the other primary arm for purposes of, for instance,workpiece swap. In some embodiments, the primary arms may not beoperated at the same time so that operation of both primary arms can becontrolled using a single motor.

In some embodiments, the processing system can include a plurality ofprocess chambers. Each process chamber can include at least twoprocessing stations. The rotary robot in the transfer chamber cantransfer workpieces among the plurality of process chambers and theloadlock chamber.

For instance, in one example implementation, the processing system caninclude two process chambers, including a first process chamber and asecond process chamber. The first process chamber and the second processchamber can be disposed on opposite sides of the transfer chamber. Therotary robot can be configured to transfer a plurality of workpiecesfrom the workpiece column in the loadlock chamber to the two or moreprocessing stations of the first process chamber and/or the two or moreprocessing stations of the second process chamber (e.g., using a scissormotion). In addition, the rotary robot can be configured to transfer aplurality of workpieces from the two or more processing stations of thefirst process chamber to the two or more processing stations of thesecond process chamber.

In another implementation, the processing system can include fourprocess chambers, including a first process chamber, a second processchamber, a third process chamber, and a fourth process chamber. Thefirst process chamber and the second process chamber can be disposed onopposite sides of the transfer chamber. The third process chamber can bedisposed in a linear arrangement with the first process chamber. Thefourth process chamber can be disposed in a linear arrangement with asecond process chamber such that the third process chamber and thefourth process chamber are disposed on opposite sides of the transferchamber.

In this particular implementation, the system can include two rotaryrobots in the transfer chamber, including a first rotary robot and asecond rotary robot. The system can further include a transfer positionbetween the first rotary robot and the second rotary robot. The transferposition can allow the first rotary robot (e.g., the rotary robot withaccess to the loadlock chamber) to transfer workpieces to the secondrotary robot. The transfer position can include a workpiece columnconfigured to support a plurality of workpieces in a stacked arrangement(e.g., on a plurality of shelves).

The first rotary robot can be configured to transfer a plurality ofworkpieces from the workpiece column in the loadlock chamber to two ormore processing stations of the first process chamber and/or the two ormore processing stations of the second process chamber and/or to theworkpiece column in the transfer position. In addition, the first rotaryrobot can be configured to transfer a plurality of workpieces among thetwo or more processing stations of the first process chamber, the two ormore processing stations of the second process chamber, and theworkpiece column of the transfer position.

The second rotary robot can be configured to transfer a plurality ofworkpieces from the workpiece column in the transfer chamber to the twoor more processing stations of the third process chamber and/or the twoor more processing stations of the fourth process chamber. In addition,the second rotary robot can be configured to transfer a plurality ofworkpieces among the two or more processing stations of the thirdprocess chamber, the two or more processing stations of the fourthprocess chamber, and the workpiece column of the transfer position.

The processing system can be further extended to include more processingchambers by adding transfer positions, rotary robots and processchambers in linear fashion to provide any number of process chambers forperforming workpiece treatments. In this way, multiple process modulescan be integrated on the proposed system without vacuum or processpressure break, enabling multiple process integration schemes includingcombination of dry etch and dry strip processes, surfacepre-clean/treatment followed by film deposition process, and consecutivefilm deposition processes, etc. Furthermore, in the proposed systemarchitecture, workpieces can be swapped back and forth between two typesof process chambers configured at opposite sides of each rotary vacuumrobot, enabling a unique cyclic process capability (e.g., such as atomiclayer etch processes).

The processing system according to example embodiments of the presentdisclosure can provide for a high productivity system with a smallfootprint. The footprint can be smaller relative to footprintsassociated with cluster-style tools. In addition, the processing systemcan process multiple workpieces (e.g., 4 workpieces, 8 workpieces, ormore) with a significant improvement in processing system efficiencymetrics, such as footprint/throughput, cost/throughput, and othermetrics.

One example embodiment of the present disclosure is directed to aprocessing system for processing a plurality of workpieces. Theprocessing system includes a loadlock chamber. The loadlock chamber caninclude workpiece column configured to support a plurality of workpiecesin a stacked arrangement. The processing system includes at least twoprocess chambers. The at least two process chambers have at least twoprocessing stations. Each processing station associated with a workpiecesupport for supporting a workpiece during processing in the processchamber. The processing system includes a transfer chamber in processflow communication with the loadlock chamber and the at least twoprocess chambers. The transfer chamber includes at least one rotaryrobot. The rotary robot has at least one arm configured to rotate aboutan axis. The rotary robot is configured to transfer a plurality ofworkpieces from the workpiece column in the loadlock chamber to the atleast two processing stations in the at least two process chambers(e.g., using a scissor motion).

In some embodiments, the at least two process chambers include a firstprocess chamber and a second process chamber, each of the first processchamber and the second process chamber comprising at least two processstations. The first process chamber and the second process chamber aredisposed on opposing sides of the transfer chamber such that the rotaryrobot can transfer the plurality of workpieces among the first processchamber and the second process chamber.

In some embodiments, the first process chamber and the second processchamber are disposed in a linear arrangement. The system includes atransfer position configured to support a plurality of workpieces in astacked arrangement. The rotary robot can be configured to transfer aplurality of workpieces from the at least two processing stations in thefirst process chamber to the stacked arrangement in the transferposition. A second rotary robot can be configured to transfer aplurality of workpieces from the stacked arrangement in the transferposition to the at least two processing stations in the second processchamber. The transfer position can be located in the transfer chamber

In some embodiments, the at least two process chambers include a firstprocess chamber and a second process chamber disposed on opposing sidesof the transfer chamber. The at least two process chambers furtherinclude a third process chamber disposed in a linear arrangement withthe first process chamber and a fourth process chamber disposed in alinear arrangement with the second process chamber such that the thirdprocess chamber and the fourth process chamber are disposed on opposingsides of the transfer chamber. Each of the first process chamber, secondprocess chamber, third process chamber, and fourth process chamber caninclude at least two process stations.

In some embodiments, the system further includes a transfer positionconfigured to support a plurality of workpieces in a stackedarrangement. The at least one rotary robot includes a first rotary robotconfigured to transfer a plurality of workpieces from the stackedarrangement in the loadlock chamber to the at least two processingstations in the first process chamber and a second rotary robotconfigured to transfer a plurality of workpieces from the stackedarrangement in the transfer position to the at least two processingstations in the third process chamber.

In some embodiments, the rotary robot has at least one primary armconfigured to rotate about a pivot point. The primary arm can be coupledto a plurality of secondary arms. Each secondary arm can be associatedwith at least one workpiece blade configured to support one of theplurality of workpieces.

In some embodiments, the rotary robot can be configured to extend thearm and to scissor open the plurality of workpiece blades to transferthe plurality of workpieces to the at least two processing stations inthe process chamber. In some embodiments, the rotary robot can beconfigured to extend the arm and to scissor open the plurality ofworkpiece blades using a single motor.

In some embodiments, the rotary robot includes a first arm having one ormore workpiece blades and a second arm comprising one or more workpieceblades. The first arm can be configured to transfer one of the pluralityof workpieces from the column in the loadlock chamber to a firstprocessing station in the process chamber and the second arm can beconfigured to transfer one of the plurality of workpieces from thecolumn in the loadlock chamber to a second processing station in theprocess chamber.

Another example aspect of the present disclosure is directed to a methodfor processing a workpiece in a semiconductor processing system. Themethod includes transferring a plurality of workpieces to a workpiececolumn in a loadlock chamber. The workpiece column configured to supporta plurality of workpieces in a stacked arrangement. The method includestransferring, with a rotary robot located in a transfer chamber, theplurality of workpieces from the workpiece column to at least twoprocessing stations in a first process chamber (e.g., using a scissormotion). The method includes performing a first treatment process on theplurality of workpieces in the first process chamber. The methodincludes transferring, with the rotary robot, the plurality ofworkpieces to at least two processing stations in a second processchamber. The method includes performing a second treatment process onthe plurality of workpieces in the second process chamber. In someembodiments, the second treatment process is different from the firsttreatment process.

In some embodiments, the method can include transferring, with therotary robot, the plurality of workpieces to a transfer position. Themethod can include transferring, with a second rotary robot disposed inthe transfer chamber, the plurality of workpieces from the transferposition to at least two processing stations in a third process chamber.The third process chamber can be disposed in linear arrangement with thefirst process chamber. The method can include performing a thirdtreatment process on the plurality of workpieces in the third processchamber. The method can include transferring, with the second rotaryrobot, the plurality of workpieces to at least two processing stationsin a fourth process chamber. The fourth process chamber can be disposedin linear arrangement with the second process chamber. The method caninclude performing a fourth treatment process on the plurality ofworkpieces in the fourth process chamber.

Yet another example aspect of the present disclosure is directed to aprocessing system for processing workpieces. The system includes aworkpiece column. The system includes a first rotary robot. The systemincludes a second rotary robot. The system includes a first processchamber. The system includes a second process chamber. The secondprocess chamber disposed in linear arrangement with the first processchamber. The system includes a transfer station. The system includes afirst rotary robot configured to transfer a workpiece from the workpiececolumn to the at least two processing stations in the first processchamber. The first rotary robot can be configured to transfer theworkpiece from the first process chamber to the transfer position. Thesystem includes a second rotary robot configured to transfer theworkpiece from the transfer position to the second process chamber.

Variations and modifications can be made to these example embodiments ofthe present disclosure. As used in the specification, the singular forms“a,” “and,” and “the” include plural referents unless the contextclearly dictates otherwise. The use of “first,” “second,” “third,” and“fourth” are used as identifiers and are directed to an order ofprocessing. Example aspects may be discussed with reference to a“substrate,” “wafer,” or “workpiece” for purposes of illustration anddiscussion. Those of ordinary skill in the art, using the disclosuresprovided herein, will understand that example aspects of the presentdisclosure can be used with any suitable workpiece. The use of the term“about” in conjunction with a numerical value refers to within 20% ofthe stated numerical value.

With reference now to the FIGS., example embodiments of the presentdisclosure will now be discussed in detail. FIG. 1 depicts a processingsystem 100 according to example embodiments of the present disclosure.The processing system 100 can include a front end portion 112, aloadlock chamber 114, a transfer chamber 115 and a plurality of processchambers, including a first process chamber 120 and a second processchamber 130.

The front end portion 112 can be configured to be maintained atatmospheric pressure and can be configured to engage workpiece inputdevices 118. The workpiece input devices 118 can include, for instance,cassettes, front opening unified pods, or other devices for supporting aplurality of workpieces. Workpiece input devices 118 can be used toprovide preprocess workpieces to the processing system 100 or to receivepost-process workpieces from the processing system 100.

The front end portion 112 can include one or more robots (notillustrated) for transferring workpieces from workpiece input devices118 to, for instance, the loadlock chamber 114, such as to and from aworkpiece column 110 located in the loadlock chamber 114. In oneexample, the robot in the front end portion 112 can transfer preprocessworkpieces to the loadlock chamber 114 and can transfer post-processworkpieces from the loadlock chamber 114 to one or more of the workpieceinput devices 118. Any suitable robot for transferring workpieces can beused in the front end portion 112 without deviating from the scope ofthe present disclosure. Workpieces can be transferred to and or from theloadlock chamber 114 through a suitable slit, opening, or aperture.

The loadlock chamber 114 can include a workpiece column 110 configuredto support a plurality of workpieces in a stacked arrangement. Theworkpiece column 110 can include, for instance, a plurality of shelves.Each shelf can be configured to support one or more workpieces. In oneexample implementation, the workpiece column 110 can include one or moreshelves for supporting preprocess workpieces and one or more shelves forsupporting post-process workpieces.

FIG. 2 depicts a side view of an example workpiece column 110 accordingto example embodiments of the present disclosure. As shown, theworkpiece column can include a plurality of shelves 111. Each shelf 111can be configured to support a workpiece 113 so that a plurality ofworkpieces 113 can be arranged on the workpiece column 110 in avertical/stacked arrangement.

Referring to FIG. 1, the loadlock chamber 114 can be used to adjust thepressure surrounding the workpieces from the pressure associated withthe front end portion 112 to a process pressure, such as a vacuum orother process pressure, prior to transfer of the workpieces to processchambers, such as first process chamber 120 and/or second processchamber 130. In some embodiments, appropriate valves can be provided inconjunction with the loadlock chamber 114 and other chambers toappropriately adjust the process pressure for processing the workpieces.In some embodiments, the loadlock chamber 114 and the transfer chamber115 can be maintained at the same pressure. In this embodiment, there isno need to seal the loadlock chamber 114 from the transfer chamber 115.Indeed, in some embodiments, the loadlock chamber 114 and the transferchamber 115 can be a part of the same chamber.

The first process chamber 120 and the second process chamber 130 can beused to perform any of a variety of workpiece processing on theworkpieces, such as vacuum anneal processes, surface treatmentprocesses, dry strip processes, dry etch processes, depositionprocesses, and other processes. In some embodiments, one or more of thefirst process chamber 120 and the second process chamber 130 can includeplasma based process sources such as, for example, inductively coupledplasma (ICP) sources, microwave sources, surface wave plasma sources,ECR plasma sources, and capacitively coupled (parallel plate) plasmasources.

As illustrated, each of the first process chamber 120 and second processchamber 130 includes a pair of processing stations in side-by-sidearrangement so that the a pair of workpieces can be simultaneouslyexposed to the same process. More particularly, the first processchamber 120 can include a first processing station 122 and a secondprocessing station 124 in side-by-side arrangement. The second processchamber 130 can include a first processing station 132 and a secondprocessing station 134 in side-by-side arrangement. Each processingstation can include a workpiece support (e.g., a pedestal) forsupporting a workpiece during processing. In some embodiments, eachprocessing station can share a common pedestal with two portions forsupporting a workpiece. The first process chamber 120 and/or the secondprocess chamber 130 can be selectively sealed off from the transferchamber 115 for processing.

According to particular aspects of the present disclosure, the transferchamber 115 can include a rotary robot 150. The rotary robot 150 can beconfigured to transfer workpieces from the workpiece column 110 in theloadlock chamber 112 to the processing stations in the first processchamber 120 and/or the second process chamber 130. The rotary robot 150can also transfer workpieces between the first process chamber 120 andthe second process chamber 130. For example, the rotary robot 150 cansimultaneously transfer the workpieces from the workpiece column in theloadlock chamber 114 to the two side-by-side processing stations 122 and124 in the first process chamber 120 using, for instance, a scissormotion. Similarly, the rotary robot 150 can simultaneously transferworkpieces from the workpiece column 110 in the loadlock chamber 112 tothe two side-by-side processing stations 132 and 134 in the secondprocess chamber 130 using, for instance, a scissor motion. Detailsconcerning the operation of an example rotary robot 150 will bediscussed with reference to FIGS. 7A to 7D and FIGS. 8A and 8B.

The rotary robot 150 can have a variety of configurations to support thetransfer of workpieces according to example embodiments of the presentdisclosure. In one embodiment, the rotary robot 150 can include a pairof arms configured to rotate about a pivot point. Each robot arm can beassociated with a pair of workpiece blades. Each workpiece blade canhave an endeffector configured to support a workpiece. The pair ofworkpiece blades associated with each arm can be used to accomplishworkpiece swap at the processing stations of the process chambers. Thepair of arms can be configured to transfer workpieces to the twoprocessing stations of each process chamber using a scissor motion.

In another example implementation, the rotary robot 150 can include atleast one primary arm that rotates about a pivot point or pivot area.The primary arm can be coupled to a plurality of secondary arms. Thesecondary arms can each be coupled to at least one workpiece blade. Eachworkpiece blade can include an endeffector for supporting a workpiece.In some embodiments, the rotary robot 150 can be configured to transferat least two workpieces from the workpiece column 110 in the loadlockchamber 112 to, for instance, two side-by-side processing stations 122and 124 in first process chamber 120 using a scissor motion. In someembodiments, the scissor motion can be implemented using a single motor.

FIG. 3 depicts a flow diagram of an example method (300) for processinga workpiece in a processing system. The method (300) can be implementedusing the processing system 100 of FIG. 1. FIG. 3 depicts stepsperformed in a particular order for purposes of illustration anddiscussion. Those of ordinary skill in the art, using the disclosuresprovided herein, will understand that various steps of any of themethods provided herein can be adapted, rearranged, performedsimultaneously, omitted, and/or modified in various ways withoutdeviating from the scope of the present disclosure.

At (302), the method includes transferring a plurality of workpieces toa workpiece column in a loadlock chamber. For instance, a plurality ofworkpieces can be transferred from a front end portion of processingchamber 100 to a workpiece column 110 in a loadlock chamber 114. Theworkpieces can be transferred to the workpiece column 110, for instance,using one or more robots associated with the front end portion of theprocessing chamber 100.

At (304), the method includes transferring, with a rotary robot locatedin a transfer chamber, the plurality of workpieces from the workpiececolumn to at least two processing stations in a first process chamber.For instance, rotary robot 150 can transfer two workpieces to processingstation 122 and processing station 124 respectively in process chamber120. In some embodiments, the rotary robot 150 can transfer workpiecesto processing station 122 and processing station 124 in process chamber120 using a scissor motion.

At (306), the method includes performing a first treatment process onthe plurality of workpieces in the first process chamber. The firsttreatment process can include, for instance, an anneal process, athermal treatment process, a surface treatment process, a dry stripprocesses, a dry etch process, a deposition process or other process.

At (308), the method includes transferring, with the rotary robot, theplurality of workpieces to at least two processing stations in a secondprocess chamber. For instance, rotary robot 150 can transfer twoworkpieces to processing station 132 and processing station 134respectively in process chamber 130. In some embodiments, the rotaryrobot 150 can transfer workpieces to processing station 132 andprocessing station 134 in process chamber 130 using a scissor motion.

In some embodiments, the rotary robot can transfer the plurality ofworkpieces to at least two processing stations in the second processchamber from the first process chamber. In some embodiments, the rotaryrobot can transfer the plurality of workpieces to at least twoprocessing stations in the second process chamber from, for instance, atransfer position as discussed in detail below (e.g., from a workpiececolumn in a transfer position).

At (310), the method includes performing a second treatment process onthe plurality of workpieces in the second process chamber. The secondtreatment process can include, for instance, an anneal process, athermal treatment process, a surface treatment process, a dry stripprocesses, a dry etch process, a deposition process or other process. Insome embodiments, the second treatment process can be the same as ordifferent from the first treatment process.

At (312), the method can include transferring the processed workpiecesback to the workpiece column in the loadlock chamber. For instance,rotary robot 150 can transfer two workpieces from the first processchamber 120 and/or the second process chamber 130. One or more robotslocated in a front end of the processing system can then transfer toprocessed workpieces to, for instance, a cassette.

According to particular aspects of the present disclosure, additionalprocess chambers can be added to the processing system in linear fashionto provide the capability to process additional workpieces. Forinstance, FIG. 4 depicts an example processing system 200 with fourprocess chambers according to example embodiments of the presentdisclosure.

Similar to the processing system of FIG. 1, the processing system 200 ofFIG. 4 can include a front end portion 112, a loadlock chamber 114, atransfer chamber 115 and a plurality of process chambers, including afirst process chamber 120 and a second process chamber 130. The systemcan include a first rotary robot 150 for transferring workpieces to andfrom the workpiece column 110 in the loadlock chamber and the firstprocess chamber 120 and second process chamber 130 and/or between thefirst process chamber 120 and the second process chamber 130.

Additionally, the processing system 200 can include additional processchambers, including a third process chamber 170 and fourth processchamber 180. The third process chamber 170 is disposed in lineararrangement with the first process chamber 120 and the fourth processchamber 180 is disposed in linear arrangement with the second processchamber 130 such that the third process chamber 170 and the fourthprocess chamber 180 are disposed on opposing sides of the transferchamber 115.

The third process chamber 170 and the fourth process chamber 180 can beused to perform any of a variety of workpiece processing on theworkpieces, such as vacuum anneal processes, thermal treatment process,surface treatment processes, dry strip processes, dry etch processes,deposition processes, and other processes. In some embodiments, one ormore of the third process chamber 170 and the fourth process chamber 180can include plasma based process sources such as, for example,inductively coupled plasma (ICP) sources, microwave sources, surfacewave plasma sources, ECR plasma sources, and capacitively coupled(parallel plate) plasma sources.

As illustrated, each of the third process chamber 170 and fourth processchamber 180 includes a pair of processing stations in side-by-sidearrangement so that a pair of workpieces can be simultaneously exposedto the same process. More particularly, the third process chamber 170can include a first processing station 172 and a second processingstation 174 in side-by-side arrangement. The fourth process chamber 180can include a first processing station 182 and a second processingstation 184 in side-by-side arrangement. Each processing station caninclude a workpiece support (e.g., a pedestal) for supporting aworkpiece during processing. In some embodiments, the third processchamber 170 and/or the fourth process chamber 180 can be selectivelysealed off from the transfer chamber 115 for processing.

To transfer workpieces to the third process chamber 170 and secondprocess chamber 180, the system 200 can further include a transferposition 162 and a second rotary robot 190. The transfer position 162can be a part of the transfer chamber 162 or can be a separate chamber.The transfer position 162 can include a workpiece column 160 forsupporting a plurality of workpieces in a stacked arrangement. Forinstance, the workpiece column 160 can include a plurality of shelvesconfigured to support workpieces in a stacked vertical arrangement. Thefirst rotary robot 150 can be configured to transfer workpieces from theworkpiece column 110, the first process chamber 120, or the secondprocess chamber 130 to the workpiece column 160 in the transfer position162.

FIG. 5 depicts a side view of an example workpiece column 160 in atransfer position 162 according to example embodiments of the presentdisclosure. As shown, the workpiece column can include a plurality ofshelves 161. Each shelf 161 can be configured to support a workpiece 163so that a plurality of workpieces 163 can be arranged on the workpiececolumn 160 in a vertical/stacked arrangement.

A second rotary robot 190 can be configured to transfer workpieces fromthe workpiece column 160 in the transfer position 162 to the processingstations in the third process chamber 170 and/or the fourth processchamber 180. The rotary robot 190 can also transfer workpieces from thethird process chamber 170 to the fourth process chamber 180. Forexample, the rotary robot 190 can simultaneously transfer the workpiecesfrom the workpiece column 160 in the transfer to the two side-by-sideprocessing stations 172 and 174 in the third process chamber 170 using,for instance, a scissor motion. Similarly, the rotary robot 190 cansimultaneously transfer workpieces from the workpiece column 160 in thetransfer position 162 to the two side-by-side processing stations 182and 184 in the fourth process chamber 130 using, for instance, a scissormotion.

The rotary robot 190 can have a variety of configurations to support thetransfer of workpieces according to example embodiments of the presentdisclosure. In one embodiment, the rotary robot 150 can include a pairof arms configured to rotate about a pivot point. Each robot arm can beassociated with a pair of workpiece blades. Each workpiece blade canhave an endeffector configured to support a workpiece. The pair ofworkpiece blades associated with each arm can be used to accomplishworkpiece swap at the processing stations of the process chambers. Thepair of arms can be configured to transfer workpieces to the twoprocessing stations of each process chamber using a scissor motion.

In another example implementation, the rotary robot 190 can include atleast one primary arm that rotates about a pivot point or pivot area.The primary arm can be coupled to a plurality of secondary arms. Thesecondary arms can each be coupled to at least one workpiece blade. Eachworkpiece blade can include an endeffector for supporting a workpiece.In some embodiments, the rotary robot 190 can be configured to transferat least two workpieces from the workpiece column 160 in the transferposition 162 to, for instance, two side-by-side processing stations 172and 174 in the third process chamber 170 using a scissor motion. In someembodiments, the scissor motion can be implemented using a single motor.

The processing system 200 includes four process chambers 120, 130, 170,and 180 and can be configured to simultaneously process up to eightworkpieces at a time. Additional process stations can be added in linearfashion to provide additional processing capability. For instance, afifth process chamber can be added in linear arrangement with the thirdprocess chamber 170. A sixth process chamber can be added in lineararrangement with the fourth process chamber 180. An additional transferposition and rotary robot can be used to transfer workpieces to and fromthe fifth and sixth process chambers. Additional processing chambers canbe included by extending the processing system in linear fashion in thismanner.

FIGS. 6A and 6B depict a flow diagram of an example method (400) forprocessing a workpiece in a processing system. The method (400) can beimplemented using the processing system 200 of FIG. 4. FIGS. 6A and 6Bdepict steps performed in a particular order for purposes ofillustration and discussion. Those of ordinary skill in the art, usingthe disclosures provided herein, will understand that various steps ofany of the methods provided herein can be adapted, rearranged, performedsimultaneously, omitted, and/or modified in various ways withoutdeviating from the scope of the present disclosure.

At (402), the method includes transferring a plurality of workpieces toa workpiece column in a loadlock chamber. For instance, a plurality ofworkpieces can be transferred from a front end portion of processingchamber 100 to a workpiece column 110 in a loadlock chamber 114. Theworkpieces can be transferred to the workpiece column 110, for instance,using one or more robots associated with the front end portion of theprocessing chamber 100.

At (404), the method includes transferring, with a rotary robot locatedin a transfer chamber, the plurality of workpieces from the workpiececolumn to at least two processing stations in a first process chamber.For instance, rotary robot 150 can transfer two workpieces to processingstation 122 and processing station 124 respectively in process chamber120. In some embodiments, the rotary robot 150 can transfer workpiecesto processing station 122 and processing station 124 in process chamber120 using a scissor motion.

At (406), the method includes performing a first treatment process onthe plurality of workpieces in the first process chamber. The firsttreatment process can include, for instance, an anneal process, athermal treatment process, a surface treatment process, a dry stripprocesses, a dry etch process, a deposition process or other process.

At (408), the method can include transferring, with the rotary robot,the plurality of workpieces to a transfer position. Rotary robot 150 cantransfer two workpieces to processing station 122 and processing station124 respectively in process chamber 120. In some embodiments, the rotaryrobot 150 can transfer workpieces to a workpiece column 160 located at atransfer position 162.

At (410), the method can include transferring, with a second rotaryrobot disposed in the transfer chamber, the plurality of workpieces fromthe transfer position to at least two processing stations in a thirdprocess chamber. The third process chamber can be disposed in lineararrangement with the first process chamber. For instance, rotary robot190 can transfer two workpieces from workpiece column 160 in thetransfer position 162 to processing station 172 and processing station174 respectively in process chamber 170. In some embodiments, the rotaryrobot 190 can transfer workpieces to processing station 172 andprocessing station 174 in process chamber 170 using a scissor motion.

At (412) the method can include performing a third treatment process onthe plurality of workpieces in the third process chamber. The thirdtreatment process can include, for instance, an anneal process, athermal treatment process, a surface treatment process, a dry stripprocesses, a dry etch process, a deposition process or other process.

At (414), the method can include transferring, with the second rotaryrobot, the plurality of workpieces to at least two processing stationsin a fourth process chamber. The fourth process chamber can be disposedin linear arrangement with the second process chamber. For instance,rotary robot 190 can transfer two workpieces from workpiece column 160in the transfer position 162 to processing station 182 and processingstation 184 respectively in process chamber 180. For instance, therotary robot 190 can transfer workpieces to processing station 182 andprocessing station 184 in process chamber 180 using a scissor motion. Insome embodiments, the rotary robot 190 can transfer two workpieces fromthe process chamber 170 to processing station 182 and processing station184 in process chamber 180. For instance, the rotary robot 190 cantransfer workpieces to processing station 182 and processing station 184in process chamber 180 using a scissor motion

At (416), the method can include performing a fourth treatment processon the plurality of workpieces in the fourth process chamber. The fourthtreatment process can include, for instance, an anneal process, athermal treatment process, a surface treatment process, a dry stripprocesses, a dry etch process, a deposition process or other process.

At (418), the method can include transferring, by the second rotaryrobot, the plurality of workpieces back to the transfer position. Forinstance, rotary robot 190 can transfer workpieces from the processchamber 170 and/or the process chamber 180 to a workpiece column 160located at the transfer position 162.

At (422), the method includes transferring, with the rotary robot, theplurality of workpieces to at least two processing stations in a secondprocess chamber. For instance, rotary robot 150 can transfer twoworkpieces to processing station 132 and processing station 134respectively in process chamber 130. In some embodiments, the rotaryrobot 150 can transfer workpieces to processing station 132 andprocessing station 134 in process chamber 130 using a scissor motion.

In some embodiments, the rotary robot can transfer the plurality ofworkpieces to at least two processing stations in the second processchamber from the first process chamber 120. In some embodiments, therotary robot can transfer the plurality of workpieces to at least twoprocessing stations in the second process chamber 120 from, forinstance, a workpiece column 160 located at a transfer position 162.

At (424), the method includes performing a second treatment process onthe plurality of workpieces in the second process chamber. The secondtreatment process can include, for instance, an anneal process, athermal treatment process, a surface treatment process, a dry stripprocesses, a dry etch process, a deposition process or other process. Insome embodiments, the second treatment process can be the same as ordifferent from the first treatment process, the third treatment process,and/or the fourth treatment process.

At (426), the method can include transferring the processed workpiecesback to the workpiece column in the loadlock chamber. For instance,rotary robot 150 can transfer two workpieces from the first processchamber 120 and/or the second process chamber 130. One or more robotslocated in a front end of the processing system can then transfer toprocessed workpieces to, for instance, a cassette.

Referring to FIGS. 7A to 7D, the operation of an example a rotary robot150 according to an example embodiment will be set forth. The rotaryrobot 150 of FIGS. 7A-7D includes two primary robot arms 152 and 154configured to rotate about a fixed point. Each of the robot arms 152 and154 can include at least one workpiece blade. For instance, robot arm152 can include workpiece blade 156. Robot arm 154 can include workpieceblade 158. Each workpiece blade 156 and 158 can be configured to grab,hold, and release a workpiece using, for instance, a suitableendeffector. In some embodiments, each of the robot arms 152 and 154 caninclude a pair of workpiece blades. The additional workpiece blades canbe used, for instance, for workpiece swap. Each of the robot arms 152and 154 can be independently operated using, for instance, a motor.

As shown in FIG. 7A, both robot arms 152 and 154 of the rotary robot 150can be extended to grab a workpiece from the workpiece column 110 in theloadlock chamber 112 using a workpiece blade. For instance, robot arm152 can be extended to grab a workpiece from workpiece column 110 usingworkpiece blade 156. Robot arm 154 can be extended to grab a workpiecefrom workpiece column 110 using workpiece blade 158. As shown in FIG.7B, the rotary robot 150 can then be operated to retract the robot arms152 and 154 to a retracted position.

FIG. 7C shows the transfer of workpieces to side-by-side processingstations 132 and 134 in process chamber 130 according to exampleembodiments of the present disclosure. The first robot arm 152 can berotated and extended so that a workpiece blade can transfer a workpieceto the first processing station 132. Prior to the actual transfer of theworkpiece to the first processing station, a second workpiece bladeassociated with the first robot arm 152 can grab a workpiece alreadylocated on the first processing station 132. The second robot arm 154can be rotated and extended so that a workpiece blade can be transfer tothe second processing station 134. Prior to the actual transfer of theworkpiece to the first processing station, a second workpiece bladeassociated with the second robot arm 154 can grab a workpiece alreadylocated on the second processing station 134. In particular embodiments,the first robot arm 152 and the second robot arm 154 can be operated ina scissor motion fashion such that the second robot arm 154 separatesfrom the first robot arm 152. In some embodiments, the robot arms 152and 154 can simultaneously transfer workpieces to the first processingstation 132 and the second processing station 134 respectively.

Once the workpieces that were previously located at processing stations132 and 134 have been grabbed and the new workpieces have beentransferred to the processing stations 132 and 134, the rotary robot 150can be operated to retract robot arms 152 and 154 to a retractedposition. The rotary robot 150 can then be rotated and operated todeliver workpieces to other portions of the system, such as workpiececolumn 110 in the loadlock chamber 112, the workpiece column 160 in thetransfer position 162, or the processing stations 122 and 124 in theprocess chamber 120.

FIGS. 8A and 8B depict the operation of an example a rotary robot 150according to another example embodiment of the present disclosure. Therotary robot 150 of FIGS. 8A and 4B includes a single primary robot arm252 and two secondary robot arms 253 and 254 attached to the primary arm252 at a pivot point on the primary robot arm 252. Each of the secondaryrobot arms 253 and 254 can include at least one workpiece blade. Forinstance, secondary robot arm 253 can include workpiece blade 255.Secondary robot arm 254 can include workpiece blade 256. Each workpieceblade 255 and 256 can be configured to grab, hold, and release aworkpiece using, for instance, a suitable endeffector. In someembodiments, each of the robot arms secondary 253 and 254 can eachinclude a pair of workpiece blades. The additional workpiece blades canbe used, for instance, for workpiece swap.

Referring to FIG. 8A, the rotary robot 150 can be operated to extend theprimary robot arm and the secondary robot arms to grab a workpiece fromthe workpiece column 110 using a workpiece blade. Each secondary arm cangrab a workpiece using a suitable workpiece blade. The robot 150 canthen retract the primary robot arm and secondary robot arms to aretracted position. The robot 150 can then rotate the primary robot armand secondary robot arms to a position to deliver the workpieces to, forinstance, the first process chamber 120.

As shown in FIG. 8B, the rotary robot 150 can extend the primary robotarm 252. The secondary robot arms 253 and 254 can be caused to move in ascissor motion 260 (e.g., separate from one another) to simultaneouslydeliver the workpieces to the first processing station 122 and thesecond processing station 124 in the process chamber 120.

Various mechanisms can be used to operate the secondary arms 253 and 254in a scissor motion. For instance, in one example, a mechanism (e.g., adividing member) can be positioned to separate the secondary robot arms253 and 254 in a scissor motion when the rotary robot extends theprimary arm 252. In this way, the extension of the primary robot arm 252and the secondary robot arms 253 and 254 according to exampleembodiments can be operated using a single motor. In another example,the rotary robot 150 can include one or more additional motors toindependently operate the secondary robot arms 253 and 254 in a scissormotion, different from a motor to operate the primary robot arm 252, todeliver workpieces to the processing stations 122 and 124. In some otherembodiments, a mechanism can be positioned to cause the scissor motionof the secondary robot arms 253 and 254 by the rotation angle of therotary robot 150. As shown in FIGS. 4A and 4B, the secondary arms 253and 254 can be caused to move in a scissor motion 260 when the rotaryrobot 150 rotates toward the process chamber 120, but not when therotary robot 150 rotates toward the workpiece column 110.

In another example implementation, the rotary robot 150 can include asecond primary arm (not illustrated). The second primary arm can havetwo secondary robot arms. Each of the secondary robot arms can includeat least one workpiece blade. The secondary robot arms attached to thesecond primary robot arm can be caused to move in a scissor motion(e.g., separate from one another), and the workpiece blades cansimultaneously grab the workpieces already located on the processingstations 122 and 124 in the process chamber 120, prior to the actualtransfer of the new workpieces to process chamber 120 by the secondaryrobot arms 253 and 254 attached to the first primary robot arm 252. Inanother example, the two primary arms never extend at the same time andcan be operated using a single motor.

The above examples of operation of the rotary robot for transferringworkpieces in a processing system are provided for purposes ofillustration and discussion. Those of ordinary skill in the art, usingthe disclosures provided herein, will understand that many differentmodes of operating the rotary robot can be used without deviating fromthe scope of the present disclosure.

While the present subject matter has been described in detail withrespect to specific example embodiments thereof, it will be appreciatedthat those skilled in the art, upon attaining an understanding of theforegoing may readily produce alterations to, variations of, andequivalents to such embodiments. Accordingly, the scope of the presentdisclosure is by way of example rather than by way of limitation, andthe subject disclosure does not preclude inclusion of suchmodifications, variations and/or additions to the present subject matteras would be readily apparent to one of ordinary skill in the art.

1-20. (canceled)
 21. A processing system for processing a plurality ofworkpieces, the processing system comprising: a loadlock chamber, theloadlock chamber comprising a workpiece column configured to support aplurality of workpieces in a stacked arrangement; at least two processchambers arranged in a linear configuration, the at least two processchambers having at least two processing stations, each processingstation associated with a workpiece support for supporting a workpieceduring processing in the process chamber; and a transfer chamber inprocess flow communication with the loadlock chamber and the at leasttwo process chambers; wherein the transfer chamber comprises at leastone rotary robot, the rotary robot comprising at least one armconfigured to rotate about an axis, the rotary robot configured totransfer a plurality of workpieces from the stacked arrangement in theworkpiece column in the loadlock chamber to the at least two processingstations in the at least two process chambers usin a scissor motion. 22.The processing system of claim 21, wherein the rotary robot isconfigured to transfer the plurality of workpieces from the workpiececolumn in the loadlock chamber simultaneously to the at least twoprocessing stations in the process chamber using a scissor motion. 23.The processing system of claim 21, wherein the at least two processchambers comprise a first process chamber and a second process chamber,each of the first process chamber and the second process chambercomprising at least two process stations.
 24. The processing system ofclaim 23, wherein the system comprises a transfer position configured tosupport a plurality of workpieces in a stacked arrangement.
 25. Theprocessing system of claim 24, wherein the rotary robot is configured totransfer a plurality of workpieces from the at least two processingstations in the first process chamber to the stacked arrangement in thetransfer position.
 26. The processing system of claim 25, wherein thesystem comprises a second rotary robot configured to transfer aplurality of workpieces from the stacked arrangement in the transferposition to the at least two processing stations in the second processchamber.
 27. The processing system of claim 25, wherein the transferposition is located in the transfer chamber.
 28. The processing systemof claim 21, wherein the at least two process chambers comprise a firstprocess chamber and a second process chamber disposed on opposing sidesof the transfer chamber, the at least two process chambers furthercomprising a third process chamber disposed in a linear arrangement withthe first process chamber and a fourth process chamber disposed in alinear arrangement with the second process chamber such that the thirdprocess chamber and the fourth process chamber are disposed on opposingsides of the transfer chamber, wherein each of the first processchamber, second process chamber, third process chamber, and fourthprocess chamber comprise at least two process stations.
 29. Theprocessing system of claim 28, wherein the system further comprises atransfer position configured to support a plurality of workpieces in astacked arrangement, wherein the at least one rotary robot comprises afirst rotary robot configured to transfer a plurality of workpieces fromthe stacked arrangement in the loadlock chamber to the at least twoprocessing stations in the first process chamber and a second rotaryrobot configured to transfer a plurality of workpieces from the stackedarrangement in the transfer position to the at least two processingstations in the third process chamber.
 30. The processing system ofclaim 21, wherein the rotary robot has at least one primary armconfigured to rotate about a pivot point, the primary arm coupled to aplurality of secondary arms, each secondary arm associated with at leastone workpiece blade configured to support one of the plurality ofworkpieces.
 31. The processing system of claim 21, wherein the rotaryrobot is configured to extend the arm and to scissor open a plurality ofworkpiece blades to transfer the plurality of workpieces to the at leasttwo processing stations in the process chamber.
 32. The processingsystem of claim 21, wherein the rotary robot is configured to extend thearm and to scissor open a plurality of workpiece blades using a singlemotor.
 33. The processing system of claim 21, wherein the rotary robotcomprises a first arm having one or more workpiece blades and a secondarm comprising one or more workpiece blades.
 34. The processing systemof claim 33, wherein the first arm is configured to transfer one of theplurality of workpieces from the column in the loadlock chamber to afirst processing station in the process chamber and the second arm isconfigured to transfer one of the plurality of workpieces from thecolumn in the loadlock chamber to a second processing station in theprocess chamber.